Direct-to-Chip Innovation: Revolutionizing Data Center Cooling for AI and HPC

Join ECS and Accelsius for an insightful webinar exploring the future of data center cooling. Discover how direct-to-chip technology addresses the escalating power and cooling demands of High-Performance Computing (HPC) and AI workloads. Hear from industry leaders Jay Lawrence, CEO of ECS, and Josh Claman, CEO of Accelsius, as they delve into the real-world applications and business impacts of this innovative solution.

When: Wednesday, June 18, 2025

Time: 12:00 pm Central / 1:00 pm Eastern

What You’ll Learn:

• Slash energy costs with direct-to-chip cooling, dramatically cutting power consumption in data centers.
• Unlock peak AI & HPC performance with optimized thermal efficiency.
• Advance sustainability by aligning direct-to-chip cooling with ESG initiatives.
• Seamless integration ECS for minimal disruption.
• Future-proof your infrastructure with cutting-edge cooling and server design innovations.

Don’t miss this opportunity to learn how direct-to-chip cooling can revolutionize your data center.