Revolutionizing Data Center Cooling for AI and HPC: Unlocking the Future of Edge Computing
As artificial intelligence (AI) and high-performance computing (HPC) workloads push traditional data centers to their limits, cooling has become one of the industry’s biggest challenges. Join Equus Compute Solutions (ECS) and Accelsius for an exclusive webinar that explores how direct-to-chip cooling technology is transforming the way data centers meet escalating power and performance demands.
In this insightful session, industry leaders Jay Lawrence, CEO of ECS, and Josh Claman, CEO of Accelsius, will share how next-generation cooling innovations are enabling:
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Higher efficiency and lower costs for HPC and AI workloads
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Scalable thermal management to meet rising density demands
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Sustainable solutions that reduce environmental impact
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Real-world applications of direct-to-chip cooling in enterprise and edge environments
Whether you manage enterprise IT, operate data centers, or are preparing for the future of edge computing, this webinar will provide practical strategies and proven insights into building data center cooling infrastructure that is smarter, more resilient, and future-ready.
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