The demand for high-performance computing is skyrocketing, and traditional cooling solutions are struggling to keep up. ECS and Accelsius have joined forces to deliver a groundbreaking approach: NeuCool™, an industry-leading, two-phase, direct-to-chip liquid cooling solution that maximizes compute power while reducing energy consumption and operational costs.
Accelsius’ patented solution handles extreme heat densities, tested up to 2200W per socket, with superior thermal uniformity to optimize AI, HPC, and enterprise workloads.
ECS ensures rapid deployment with customized server and rack solutions that fit into existing data center environments — no specialized training required.
Featuring hot-swappable components, redundant systems, and industry-first leak protection, NeuCool turns potential disasters into minor inconveniences.
Significantly reduces energy consumption and supports global ESG goals with efficient heat removal and lower total cost of ownership.
ECS, a leader in compute infrastructure integration,service and support and Accelsius, a pioneer in advanced cooling technologies, have partnered to provide seamless, scalable, and future-proof cooling solutions. Together, we ensure optimal performance, asset protection, and sustainability — all backed by lifecycle support to maximize uptime and eliminate downtime.
