R2660
R26602U 12 Bay Xeon® Scalable
- WHITEBOX OPEN™ Platform
- Dual Intel® Xeon® Scalable CPU
- 12x 3.5” Hot-Swap HDD Bays
- 16 DIMMs (up to 2TB of memory)
- OCP 1/10/25/40/50/100 GbE ports
- Open BMC Management
Product Specifications
| Chassis Dimensions | 2U Rackmount inches : 27.56 x 17.32 x 3.43 |
| Processor | Dual Intel® Xeon® Scalable (up to 205W with FRU-SO-9140) |
| Chipset | Intel® C621 Chipset |
| Drive Bays - External | 12x 3.5" HDD hotswap |
| Drive Bays - Internal | 2x SSD 7mm (rear) hot swap |
| Backplane | SAS 12Gb/s, SATA 6.0Gb/s |
| Memory | Up to 512GB RDIMM/ 1,024GB LRDIMM/ 768GB LRDIMM 3DS DDR4 2666 |
| Expansion Slots | 2x PCIe 3.0 x16 |
| Riser Card | LH riser PCIe x16, RH riser PCIe x16 (M7106-L24-3F, M7106-L24-3F) |
| OCP | 1x OCP 2.0 x16 connA+connB (LAN), 1x OCP 2.0 x16 connA+connB+connC (Stg) |
| Network Controllers | 2x 10GbE, 1x 1GbE dedicated for IPMI, Intel I210-AT |
| Graphics | Aspeed AST2500, up to 1920x1200, D-sub 15-pin connector |
| Rear I/O | 2x RJ-45 1GbE, 1x GbE dedicated for IPMI, 2x USB3.0 at rear, 1x D-SUB VGA, 1x DB-9 |
| System Management | OpenBMC, AST2500, IPMI 2.0 compliant |
| Power Supply | RPSU 770W 1+1 hot swap |
| Environmental Specs | Operating: 10° C ~ 35° C (50° F~ 95° F) |
| Gross Weight | 31 kg (68.5 lbs) |
