Intel® Celeron® M Fan-less System with NVRAM/RS 422/485

NISE 3100

Specifications

Main Board
  • ICES 101 ETX Module
  • Supports ETX Module with Celeron® M 600 MHz w/512 KB L2 Cache, VGA/ISA/PCI/IDE/LVDS/Audio/COM/LPT/USB2.0/LAN Interface
Main Memory
  • 1 x 200-pin SODIMM socket for up to 1 GB Non-ECC Non-Registered DDR SDRAM memory
I/O Interface-Front
  • Power / HDD Status LEDs
  • 2 LEDs, connect to GPIO, programmable for alarm or other applicationspecific purposes
  • 1 x PCMCIA Socket
  • 1 x external access CompactFlash socket
  • 2 x DB9 for COM1 and COM2 (Support RS 232)
  • 1 x screw terminal for COM3 and COM4 support RS 422/485 (Automatic Flow Control and Isolation up to 2000 VDC)
  • 2 x USB 2.0 ports
I/O Interface-Rear
  • 2 x 10/100 Ethernet LAN
  • 2 x USB 2.0 ports
  • 1 x KB/Mouse connector
  • +9 to +36 VDC power input
  • 1 x Power Reset Button
  • 1 x VGA Connector (DB15)
  • 1 x Audio-out and 1 x Mic-in Connector
  • 1 x Parallel Port
Device
  • 1 x front access PCMCIA socket
  • 1 x Internal CompactFlash socket
  • 1 x Internal 2.5” HDD Drive bay
  • 1 x NVRAM socket
Expansion Slot
  • 1 x PCMCIA
  • The NISE 3200 system design offers a expansion kit which is available upon ODM request.
  • Typical utilization of 2nd tier space on top of original base enclosure could include a slim-type CD-ROM or PC/104, PCI 104 or PC/104 Plus modules with defined I/Os.
  • The maximum height of the expansion kit combined with base enclosure is around 2U.
  • PC/104 (ISA), PCI 104(PCI) or PC/104 Plus module w/ defined I/O output
Dimensions
  • 260 mm (W) x 176 mm (D) x 55 mm (H)
Construction
  • Aluminum chassis with fan-less design
Environment
  • Operating temperature:
  • Ambient with air flow
    5°C to 40°C (w/HDD)
    -10°C to 50°C (w/CF Card Only)
  • Tcase (Surface Temperature of Chassis)
    5°C to 45°C (W/HDD)
    -10°C to 50°C (W/CF Card Only)
  • Storage temperature: -20°C to 80°C
  • Relative humidity: 10% to 90% (Non-condensing)
Certifications
  • CE approval
  • FCC Class A

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